About Loadpoint Ltd
We are a technology company based near Swindon, involved in developing means of precision machining the components that are required by industry to meet the challenges of our changing world.
We have developed, and are continuing to develop, machines that can cut, grind and drill a range of materials to micrometre, sub-micrometre and in some cases, nanometre tolerances for precision applications in a wide range of sensors in such fields as medical diagnostics, sonar, optical and industrial applications. These materials are used in many different industries and our efforts over the last 35 years have given us a great deal of experience of a wide range of materials and applications.
Among the many materials we are machining is the family of lead zirconate titanate (PZT) compositions and related piezoelectric, pyroelectric and ferroelectric sensor materials. The materials in question have thicknesses ranging from 100’s of microns to 10’s of mm, some of which have been metallised prior to machining. We have developed a good understanding of the fracture mechanics, electrical properties and the intricacies of precision machining and grinding these materials to fine tolerances.
Company History
Loadpoint has been providing solutions for the Semiconductor/Electronics industry for over thirty seven years, with a commitment to developing new machines and process techniques to suit market demand world wide. Product introductions and major highlights are as follows:
- 1967 First Multiple blade saw built for silicon.
- 1971 'Multi' Series production dicing machines launched for 3" wafer under the Semitron name.
- 1975 2000 System receives 'T.D.C. Technical Innovator Award for 1975'.
- 1976 Bench top dicer/scriber developed. Subcontract dicing service launched.
- 1978 Solid State bearing drive production commenced.
- 1980 MicroAce Series dicer/scriber launched across the world, incorporating microprocessor control system: Air bearing sales commenced.
- 1987 Loadpoint Machining Centre (LMC) introduced for heavy duty sawing applications.
- 1988 MicroAce Series 2 launched: Washpoint cleaning station developed.
- 1990 Air bearing company purchased.
- 1994 MicroAce Series 3 launched for 6" wafer, designed for high volume dicing/scribing and grinding production applications.
- 1995 Washpoint Mark 2 launched. CE compliance started.
- 1996 NanoAce submicron precision dicer/scriber and grinder for 12" wafer market developed.
- 1997 Electrochemical MicroMachining(EMM) process developed for high precision engineering components. 850th sawing machine shipped.
- 1998 Tetraform Nanogrinder construction started.
- 1999 Tetraform completed and delivered to Cranfield University.
- 2000 Loadpoint Precision Engineering started.
- 2001 PicoAce Wafer Grinding machine development started. All axis based on hydrostatic ways. Special Air Bearings developed.
- 2002 Trials Started on PicoAce. Results exceeded expectations.
- 2003 Development of machining PZT increased.
- 2004 Commencment of development of Massmicro project started in conjunction with 33 European institutions and companies. Project value €22,000,000.
- 2005 Design of MassMicro 5 axis machine.
- 2006 MacroAce machine developed.