What's your application - MEMS

Applications

Dicing to singulate MEMS structures on wafers and ceramics, high precision cutting and drilling of materials to produce MEMS components.

Process Targets

Developing the best techniques to dice multi-layer & multi-material structures, avoiding damage to sensitive surface topography and coatings, protection of delicate MEMS structures & bonding pads, minimising energy dissipation within the structures.

Options

There are two options for you to pursue MEMS dicing and processing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premise. Secondly, Loadpoint offer a sub-contract dicing service whereby you send us your material and specifications and we will dice and return the work for you.

Systems:

MicroAce 66: 6” / 155mm dia. x 13mm work area, 2”, 3” and 4” blade capacity

NanoAce 200: 8” / 200mm dia. X 13mm work area, 2”, 3” and 4” blade capacity

NanoAce 300: 12” / 300mm dia. x 13mm work area, 2” and 3” blade capacity

NanoAce 450: 18” x12” / 450x300mm x 10mm work area, 2” and 3” blade capacity

For post-dice cleaning: Washpoint

For preparation of tape rings / hoop rings: Presspoint

Loadpoint Production

Loadpoint’s production facility for dicing, cutting, drilling, grinding & prototyping

Click on the following links for information on our in-house production capabilities for MEMS dicing and processing:

Wafer and substrate dicing

Core drilling & micro-drilling

Micro grinding