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- "3D Silicon on Piezo" at the Piezo 2009 conference "Electroceramics for End users IV" in Zakopane 3rd March, organised by the Piezo Institute - Download PDF
- "Issues in Manufacturing of Wafer-scale 3D Piezoelectric-on-Silicon Structures" at the Bio-Sensors and MEMS packaging conference "Everything in Electronics from the Chip to the Sytem" in Edinburgh 2nd March organised by iMAPS UK Download PDF
- Press release - Loadpoint: The Wiltshire business helping keep the UK at the forefront of research and development - Download PDF
- Loadpoint and Ferro-Electric Materials Processing Technical Paper - Download PDF
- Conference Presentation - Download PDF
- Ultra precision grinding in the fabrication of high frequency piezocomposite ultrasonic transducers - Download PDF
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