News
Loadpoint Offers First 300mm Wafer Dicing Subcontract Facility in UK
Loadpoint Ltd. have announced the addition of their NanoAce 300mm diameter high-precision dicing saws to their subcontract facility in Swindon, UK. The versatile NanoAce dices materials including Alumina, BGA mouldings, Ceramic, Glass, Lead Zirconate Titanate, FibreBoard and Silicon and can be controlled in 4 axes (x, y, z, and theta). Loadpoint’s customers use the wafer dicing subcontract facility to develop dicing processes for singulation of IC’s, LED’s, MEMS and other devices. The facility benefits from both the extensive dicing experience of our staff and the versatility of our machines, which are designed and built in-house. With the development of Wafer Level Packaging dicing saws as adaptable as the NanoAce are set to become more and more valuable to product development.
Loadpoint’s experience in dicing has earned them a place among some of Europe’s leading semiconductor manufacturers who are currently researching the process technology that will enable production of the next generation of ultra-thin IC’s. Company Director John Sweet says “For semiconductor dicing high precision diamond saws like the NanoAce are the most effective option for cost and productivity. Now we are pushing back the boundaries of this field of production engineering to ever finer levels of finish and quality”
Further details on Loadpoint’s dicing subcontract facilities and their range of dicing and post-dicing equipment can be found at www.loadpoint.co.uk alternatively telephone 01793 751160 to discuss your dicing requirements with one of Loadpoint’s sales team.