Company History
Loadpoint has been providing solutions for the Semiconductor/Electronics industry for over 40 years, with a commitment to developing new machines and process techniques to suit market demand world wide. Product introductions and major highlights are as follows:
- 1967 First Multiple blade saw built for silicon.
- 1971 'Multi' Series production dicing machines launched for 3" wafer under the Semitron name.
- 1975 2000 System receives 'T.D.C. Technical Innovator Award for 1975'.
- 1976 Bench top dicer/scriber developed. Subcontract dicing service launched.
- 1978 Solid State bearing drive production commenced.
- 1980 MicroAce Series dicer/scriber launched across the world, incorporating microprocessor control system: Air bearing sales commenced.
- 1987 Loadpoint Machining Centre (LMC) introduced for heavy duty sawing applications.
- 1988 MicroAce Series 2 launched: Washpoint cleaning station developed.
- 1990 Air bearing company purchased.
- 1994 MicroAce Series 3 launched for 6" wafer, designed for high volume dicing/scribing and grinding production applications.
- 1995 Washpoint Mark 2 launched. CE compliance started.
- 1996 NanoAce submicron precision dicer/scriber and grinder for 12" wafer market developed.
- 1997 Electrochemical MicroMachining(EMM) process developed for high precision engineering components. 850th sawing machine shipped.
- 1998 Tetraform Nanogrinder construction started.
- 1999 Tetraform completed and delivered to Cranfield University.
- 2000 Loadpoint Precision Engineering started.
- 2001 PicoAce Wafer Grinding machine development started. All axis based on hydrostatic ways. Special Air Bearings developed.
- 2002 Trials Started on PicoAce. Results exceeded expectations.
- 2003 Development of machining PZT increased.
- 2004 Commencment of development of Massmicro project started in conjunction with 33 European institutions and companies. Project value €22,000,000.
- 2005 Design of MassMicro 5 axis machine.
- 2006 MacroAce machine developed.