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 Products

• Dicing/Grinding/Drilling/Milling

  

  MicroAce Series 3, NanoAce, NanoAce TNC, PicoAce, MacroAce and Washpoint.

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• Subcontract Processing

  

  Materials machined with thirty years machining experience include Silicon, Silicon Carbide...

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• Consumables

  

  Blades & Spacers, Wafer Mounting, Wafer Mounting Tape and Wafer Shippers.

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• Support Products

  

  Air Bearing Spindles, Chucks, Presspoint, Twin Videoscope and Mist Extractors.

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• Servicing and Spares

  

  Machines manufactured by Loadpoint over 30 years ago are still in daily use for high precision dicing...

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• Cardboard Packaging Machinery

  

  The Loadpoint Die Cutter provides the substantial equipment gap that exists between hand fed platens...

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