Dicing/Grinding/Drilling/Milling
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Nano Control
The user friendly Nano Control system is a common control platform used across the range of Loadpoint cutting machines.
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MicroAce 66
The new MicroAce 66 150mm micro dicing machine builds on the rugged reliable reputation of the MicroAce series 3 for applications from prototypes to production volumes.
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MicroAce Series 3
MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/Semi-conductor industry.
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MacroAce
The MacroAce is a very large capacity dicing machine with considerable X,Y & Z movements. Z capacity for multi angle work orientation is available.
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NanoAce
Loadpoint's NanoAce is a high precision machine tool suitable for machining the latest components produced by the Electronics / Semiconductor and related industries and has a cutting capacity of over 300x300 mm.
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NanoAce TNC
The NanoAce can be fitted with Heidenhein TNC controller to give greater flexibility and capacity for complex CNC style cutting operations.
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Washpoint
The Washpoint is a self contained, free standing washing station for cleaning and drying wafers/substrates up to 12 "/300mm in diameter following dicing, scribing or other machining processes.