MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/Semi-conductor industry.
Dicing/Grinding/
Drilling/Milling
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MicroAce Series 3
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NanoAce
Loadpoint's NanoAce is a high precision machine tool suitable for machining the latest components produced by the Electronics/Semiconductor and related industries.
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NanoAce TNC
Loadpoint's NanoAce, a high precision machine tool suitable for the latest components produced by the Electronics/Semiconductor and related industries.
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PicoAce
PicoAce is designed for ultra precision grinding of hard and brittle materials of up to 305 mm in diameter as a development of the Tetraform C.
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MacroAce
The MacroAce is a very large capacity dicing machine with considerable X,Y & Z movements. The structure is based on a grinding machine adapted to be a highly flexible dicing machine. Z capacity for multi angle work orientation is available.
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Washpoint
The Washpoint is a self contained, free standing washing station for cleaning and drying wafers/substrates up to 12 "/300mm in diameter following dicing, scribing or other machining processes.