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MicroAce Dicing - series 3
Overview
The MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/ Semiconductor industry.
It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter.
Download PDFThe MicroAce series 3 is available "rebuilt-as-new" through our machine reconditioning programme. Each one is stripped, rebuilt and calibrated in the factory where they were first manufactured, parts are replaced as required - normally 60% approx. in total - providing an extremely high quality of finish.
- Powered with custom-built air-bearing dicing spindle.
- Proven high reliability and long lifespan.
- Rigid structure ensures high accuracy and consistent performance in both volume production and R&D environments.
- Available with optional PC data entry and storage.
MicroAce series 3 rebuilt-as-new is very competitively priced.
Loadpoint is committed to its long-standing policy of continual machine support and the series 3 will be supported for many years to come in technical assistance, on-site maintenance visits and replacement parts.