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MicroAce Dicing

Overview

MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/ Semiconductor industry.

It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter.

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Powered with custom-built air-bearing dicing spindle.

Proven high reliability and long lifespan.

Rigid structure ensures high accuracy and consistent performance in both volume production and R&D environments.

Available with optional PC data entry and storage.

The MicroAce carries the CE mark to show compliance with the relevant European Safety Standards.

MicroAce is very competetively priced.

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