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Subcontract Processing
Materials machined with thirty years machining experience include Silicon, Silicon Carbide, Glass, Gallium Arsenide, Lithium Niobate and Lithium Tantalate, Lead Zirconate Titanate (PZT), Sapphire.
Subcontract processes offered include dicing, grinding, thinning, drilling, milling slotting, chamfering, profilling and local area polishing all with post-process cleaning and to the latest 300mm diameter industry standard.
Work pieces handled include wafers, substrates, plates, laminates,
rods, blocks, tubes and assemblies.
Machining can be temperature controlled, and standard coolant exchanged for deionised 16 meg-ohm water with full or partial reionisation.
Film frames, tape rings, shippers and a full range of mounting tapes, including UV curable tapes are supplied.
Recently completed major programme of refitting at our subcontract facility near Swindon now offering unrivalled support for customers who require process development or rapid turn around. Loadpoint have invested in 300mm wafer dicing, drilling, polishing, grinding and washing equipment, including:
- TNC controlled NanoAce micro-drilling/milling machine
- Washpoint 300mm diameter wafer washing station
- PicoAce Ultra-high Precision Grinding/Polishing machine, capable of Nano-scale precision
.. creating one of the most advanced facilities in Britain for subcontract wafer machining.