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Subcontract Processing
Materials diced over our 40 years machining experience include Silicon, Silicon Carbide, Glass, Quartz, Gallium Arsenide, Lithium Niobate and Lithium Tantalate, Sapphire, Lead Zirconate Titanate (PZT) and various other Ceramics, all with post-process cleaning and to the latest 300mm diameter industry standard.
From our wide range of machining experience and bespoke equipment development, we can also offer grinding, thinning, drilling, milling, slotting, chamfering, profiling and local area polishing facilities.
Work pieces handled include wafers, substrates, plates, laminates,
rods, blocks, tubes and assemblies.
Machining can be temperature controlled, and standard coolant exchanged for deionised 16 meg-ohm water with full or partial reionisation.
Following a major refit at our subcontract facility near Swindon we now offer unrivalled support for customers who require process development or rapid turn around. Loadpoint have invested in 300mm wafer dicing, drilling, polishing, grinding and washing equipment, including:
- TNC controlled NanoAce micro-drilling/milling machine
- MacroAce heavy duty dicing system for components up to 35mm thick
- Washpoint 300mm diameter wafer washing station
- PicoAce Ultra-high Precision Grinding/Polishing machine, capable of Nano-scale precision
.. creating one of the most advanced facilities in the UK for micro machining.