Meet Loadpoint at SEMICON China 2026

Meet Loadpoint at SEMICON China 2026 | Air Bearing Spindles for Critical Semiconductor Processes

Loadpoint will be exhibiting at SEMICON China 2026, and we’d love to meet you in Shanghai.

Event details

• Date: 25–27 March 2026
• Venue: Shanghai New International Expo Centre (SNIEC)
• Booth: Hall T2, T2340

As one of the most important annual events for the semiconductor industry, SEMICON China is a key opportunity for us to reconnect with partners, meet new equipment OEMs, and discuss real application challenges—from precision, stability, and yield improvement, to speed, integration, and long-term reliability.

Air Bearing Spindles: The Core of High-Precision Semiconductor Equipment

In semiconductor manufacturing, many of the most demanding processes rely on ultra-stable, ultra-precise rotary motion. Air bearing spindle technology helps reduce vibration, minimize runout, and deliver the consistency required for today’s increasingly advanced wafers and tighter tolerances.

At SEMICON China, we will showcase a range of air bearing spindle solutions for semiconductor equipment, including:

• Air Bearing Dicing Spindles
• Wafer Back Grinding Spindles
• Wafer Edge / Notch Grinding Spindles
• Wafer Inspection Rotary Table (Air Bearing Rotary Table)

These components are not “optional extras”—they are often the critical core parts of the tool, directly impacting accuracy, throughput, and overall equipment performance.

Let’s Talk OEM Integration, Custom Requirements, and Fast Collaboration

Whether you are:

• a semiconductor equipment OEM,
• a system integrator,
• a precision motion / spindle solution partner, or
• exploring upgrades for performance, stability, or lifecycle improvements,

we welcome you to visit Hall T2, Booth T2340 for a technical discussion with our team.

Book a Meeting with Our China Team

To make the most of the show, we encourage you to pre-book a meeting slot with our China team.

📩 Contact: Lesley Liu
Email: Lesley@loadpoint.co.uk

Please include a short note with:

• your application / process (dicing, grinding, inspection, etc.)
• tool type or current spindle model (if applicable)
• preferred meeting date/time during 25–27 March

 See you in Shanghai.