This September, Loadpoint is excited to showcase our latest air bearing spindle solutions at two major industry exhibitions in China. We warmly welcome customers and partners to visit our booths, explore our products, and exchange ideas with our team.
September 4–6, 2025 | Wuxi Taihu International Expo Centre | Booth A6-487
At this leading semiconductor event, we will highlight how air bearing technology is applied across critical semiconductor processes — including wafer dicing, grinding, inspection, and metrology. Visitors will see our full range of products, such as dicing spindles, wafer inspection spindles, wafer back-grind spindles, wafer back-grind rotary tables, wafer edge-grinding spindles, and more.
September 10–12, 2025 | Shenzhen World Exhibition and Convention Center | Booth 3A-35
At CIOE 2025, Loadpoint will present our precision air bearing spindle and rotary table solutions for the optics and optoelectronics industry. On display will be optical spindles, diamond tooling spindles, rotary tables, etc., demonstrating how air bearing technology enables ultra-precision in optical applications.
✨ We look forward to meeting industry professionals from around the world at both events! For more information or to arrange a meeting during the exhibitions, please contact us:
📧 Global inquiries: sales@loadpoint.co.uk
📧 China region: sales@loadpoint.cn