The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle sets-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.

The NanoAce 3200 is an 8” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3200 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The NanoAce 3300 is a 12” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3300 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

MacroAce II for heavier duty applications requiring high power spindle delivery and large work areas. The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic & metal cutting applications. Additionally, cut depths of up to 55mm with cut lengths up to 420mm help make the MacroAce II a best-in-class leader.

The MacroAce II VS is a vertical spindle drilling system that can be used for core drilling, micro drilling and milling of a variety of substrates. The MacroAce II VS utilises an air bearing spindle to provide the best performance in regard to accuracy and quality of cut. Full automatic program control is achieved via Loadpoint’s own Nanocontrol System.

Automatic washing and drying station.

The Washpoint is a self-contained, fully integrated free standing washing station for cleaning and drying wafers, substrates or plates up to 300mm in diameter following dicing, scribing or other machining processes.

Wafer mounter

A low cost solution for tape ring / hoop ring preparation and mounting. Can also be used as a simple die expander.

The Loadpoint Presspoint is one of the most versatile and efficient manual closing and post dicing stretch systems available. It requires no power and is usable straight from the box.