Microace 66
The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard while other spindle set-ups are also available to suit a variety of applications including thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.
Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.
Another feature of NanoControl is that it can be tailored to specific requirements. This could involve taking the hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.
Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.
Another feature of NanoControl is that it can be tailored to specific requirements. This could involve taking the hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.
Nanoace 3200
The NanoAce 3200 is an 8” dicing saw that also serves many applications in larger area substrate cutting and dicing. The NanoAce 3200 is an automatic dicing saw with a vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.
The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.
NanoControl can be developed bespoke to a customer’s application. This could involve taking the hassle out of calculating complex cut patterns or easy generation of 3D cutting profiles.
The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.
NanoControl can be developed bespoke to a customer’s application. This could involve taking the hassle out of calculating complex cut patterns or easy generation of 3D cutting profiles.
Nanoace 3300
The NanoAce 3300 is a 12” dicing saw that also serves many applications in larger area substrate cutting and dicing. The NanoAce 3300 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.
The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.
NanoControl can be developed bespoke to a customer’s application. This could involve taking the hassle out of calculating complex cut patterns or easy generation of 3D cutting profiles.
The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.
NanoControl can be developed bespoke to a customer’s application. This could involve taking the hassle out of calculating complex cut patterns or easy generation of 3D cutting profiles.
Macroace II
MacroAce II for heavier duty applications requiring high power spindle delivery and large work areas.
The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic and metal cutting applications.
Additionally, cut depths of up to 55mm with cut lengths of up to 450mm help make the MacroAce II a best-in-class leader.The MacroAce II is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays.T
he performance of the MacroAce II is underpinned by the Loadpoint NanoControl control system; a common control platform used across all our machines. Another feature of NanoControl is that it can be developed bespoke to a customer’s application.
This could involve taking the hassle out of calculating complex cut patterns or easy generation of 3D cutting profiles.
The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic and metal cutting applications.
Additionally, cut depths of up to 55mm with cut lengths of up to 450mm help make the MacroAce II a best-in-class leader.The MacroAce II is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays.T
he performance of the MacroAce II is underpinned by the Loadpoint NanoControl control system; a common control platform used across all our machines. Another feature of NanoControl is that it can be developed bespoke to a customer’s application.
This could involve taking the hassle out of calculating complex cut patterns or easy generation of 3D cutting profiles.