NanoAce fully automatic duo pro 🆕
The NanoAce Fully Automatic Duo Pro is a newly developed 12" fully automatic dicing saw, equipped with two facing spindles that can dice workpieces simultaneously at high throughput, a vision alignment system and high resolution closed loop linear positioning encoders in Y axes where high performance tolerances are required.
This machine is highly cost-effective due to its rapid dicing speed and fully automated operation. It features an auto-alignment function, auto kerf check function, self-adjustment function, and statistical analysis function. A high-power spindle is also available for this machine.
The performance of the NanoAce Fully Automatic Duo Pro is underpinned by a new Loadpoint NanoControl control system, which is equipped with a user-friendly 17" LCD touch screen and operated through an intuitive new user interface.
| Max. Work Capacity (X, Y, Z) | 300mm x 300mm x 13mm |
| Blade Capacity | 50.8mm – 101.6mm |
| Chuck-type | Ceramic or metal vacuum |
| Spindle Options | 1.8kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 60,000rpm |
| Dimensions (W x D x H) | 1046mm x 1030mm x 2048mm (height includes traffic light) |
Dicing solutions for:
From Prototype to Production and Everything In-between
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FROM THE LATEST WAFER DESIGNS TO CERAMIC COMPONENTS AND EVERYTHING IN BETWEEN
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WITH THE MAXIMUM STROKE OF 30MM IN THE Z AXIS, THE NANOACE FULLY AUTOMATIC DUO PRO HAS ALL DICING REQUIREMENTS COVERED
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TOTAL FLEXIBILITY, TOTAL CONTROL
OPERATIONAL SPECIFICATION
| Control System | Loadpoint NanoControl 3.0 |
| Work Holding | Ceramic or Metal Vacuum Chuck |
| Work Capacity (XYZ) | Wafer：12" Square：260 x 260 x 4mm（full cut） 260 x 260 x 6mm（partial cut） |
| Blade Capacity (Diameter) | 49mm – 60mm |
| Spindle Power | 1.8 KW @ 60,000 rpm |
| X Axis Cutting Range | 310 mm |
| X Axis Resolution | 0.1 µm |
| X Axis Feed Rate | 0.01 - 800 mm/s |
| Y Axis Index Range | 0.001 - 310 mm |
| Y Axis Resolution | 0.1 µm |
| Y Axis Index Accuracy | Within 3μm / 310 mm (Single step accuracy) with 2μm / 5 mm |
| Z Axis Index Range | 0.001 - 30mm |
| Z Axis Resolution | 0.1µm |
| Z Axis Index Accuracy | Repeated positioning accuracy: 1 μm |
| Theta Axis Drive | Direct Drive Torque motor |
| Theta Axis Range | 380°(continuous) (-60°～320°) |
| Theta Axis Resolution | ±3.0 Arc sec |
| Camera Type | Monochromatic |
| Camera Alignment | Manual or fully automatic |
| Camera Resolution | 2 MegaPixels |
| Camera Magnification | x48 - x96 - x386 |
| Camera Illumination | Coaxial and ring (with dark field option) |
| Footprint (WDH) (height includes status light) | 1220mm x 1550mm x 1850mm |
SERVICE REQUIREMENTS
| Electricity | - 220v AC ±10% three phase 20A, 50/60Hz - 380v AC ±10% three phase 20A, 50/60Hz |
| Air supply | 5 - 8 Bar |
| 500 L/min | |
| Blade coolant | 3 - 4 Bar |
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Cutting Water 12 L/min |
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| Workpiece wash | 3 - 4 Bar |
| Wash water 2 L/min | |
| Spindle coolant | 3 - 4 Bar |
| Same as ambient room temperature | |
| 3L/min | |
| Vacuum supply | Not required, internally generate |
| Mist extraction | ≥5.0m³/min |
| Drain | Connecting pipe OD φ38mm |
| Drain pipe height from ground < 550 mm | |
| Recommended Environment |
Ambient temp（22±2）℃ Fluctuation：±1℃ Ambient humidity：（55±15）%RH |
| Weight | 2200KG on 4 adjustable feet |
PIPE SIZES
| Port | Pipe Diameter |
| Cutting Wheel Blade Coolant In | 16mm |
| Wafer Wash Water In | 12mm |
| Spindle Coolant Water In | 10mm |
| Spindle Coolant Water Out | 10mm |
| Air In | 12mm |
| Vacuum Venturi Exhaust | Merges into main exhaust |
| Mist Extraction Port | φ101mm |
| Drain Port |
Connecting pipe OD: φ38mm Factory drainage outlet: ≥φ50mm Max. distance from machine: ≤2m |
Talk to us about your requirements
STANDARD PACKAGE
Loadpoint Air Bearing Spindle
- Very low vibration improves the cut quality and reduces chipping
- DC brushless drive, 1.8 kW 60,000 rev per min
- High power option 2.2 kW 60,000 rev per min
Vision and alignment system
Manual and automatic alignment modes:
- Monocular video alignment system with pattern recognition
- Pattern Recognition System (PRS)
- Automatic alignment as standard
- Automatic cutting & kerf check as standard
- Full 17” touch screen monitor for alignment, data entry and machine monitoring
- Continuous live display of X,Y,Z and theta co-ordinates
- Z autofocus set up of alignment image with offset option
Tooling
- Standard wheel carrier with 60 mm diameter blade capacity
- Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets
- Cleaning station with atomised cleaning features
- Accelerometer based Z datum set, off-chuck height sensing system
Z height sensing
Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers.
Work holding
Standard packages include adaptable plain wafer vacuum chuck for use with wax and substrate mounting and tape rings. Loadpoint manufacture chucks for all tape rings and film frames, mechanical vices, and designs to customer requirements, including precision-ground ceramic inserts for improved vacuum and component support.
Materials Processed
Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others.