washpoint300-new

WASHPOINT 300

 

 

 The Washpoint 300 is a self -contained, fully integrated free
standing washing station for cleaning and drying wafers,
substrate or plates up to 300mm in diameter following dicing, scribing or other machining processes.

A flexible washing process allows all elements of the cleaning and drying sequence; cycle time, water pressure, gas pressure and dry heat output to be easily adjusted to meet individual process demands while the compact case ensures maximum use of work areas.

Washpoint-Chuck area
Washpoint Chuck Area.
Washpoint-wash arm
Washpoint Arm.
Loadpoint washpoint 300
Interface Screen
Specification
Construction  Painted stainless steel 
Programming  Via touch sensitive screen and PLC unit 
Capacity  Up to 300mm, 12” diameter wafers, discs or plates 
Chuck  Vacuum diameter 300mm vacuum standard 
Optional  Mechanical chuck to suit wide range of ring frames 
Spin Speed  100 – 2500 rpm, subject to work type 
Water jet  Max. 7 bar (101.5psi) by air driven pump, depending on jet 
Gas Jet  Dry air or nitrogen 
Regulators  Air/nitrogen pressure, water pressure 
Interlocks  Air/nitrogen, Water and Vacuum pressure Safety interlocks and stops as defined by CE standard requirements 

 



Supplies
Electricity  200/240V AC single phase 6A, 50/60Hz 
Air Supply  6.0 bar @ 0.085 cu.m/min, 10mm pipe 
Air / Nitrogen  1.0 bar @ 10mm pipe 
DI Water  3.0 bar @ 1.0 l/min, 10mm pipe 
Mist Extraction  Integral mist extractor and vapour trap, 60mm vent 
Drain  Free open drain, not less than 300mm below outlet 
Size

620 x 800 x 920mm (w x d x h)
Weight

150 Kilograms

 

 

Cleaning & Drying Process

 The versatile washing process is adaptable to both volume production and research and development environments. An automatic mode follows a programmed wash and dry sequence to ensure improved production throughput, while a manual mode Detergent injection allows independent control of all elements of the process.

The washing cycle uses filtered high pressure water supplied by a powerful air driven pump to clean the component, and water
may be de-ionised or contain additives depending on application. The drying sequence directs a dry air or nitrogen jet across the
component surface to clear the water particles. An optional inline heater warms the drying gas and component to enhance the effectiveness of the drying process. An integral mist extraction unit draws off spray and vapour to provide a superior cleaning environment.

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