AV - 50 UV Curing System
The AV-50 semi-automatic UV irradiation system
is designed for UV-curable dicing tape attached to
film frames used with 150 mm, 200 mm, and
300 mm wafers. It provides consistent and uniform
UV exposure to ensure optimal tape curing
performance, improving wafer handling efficiency and
tape release characteristics during the dicing
process.
Specification
| Wafer Capacity | 150mm / 200mm / 300mm |
| Film Frames | 6, 8 & 12" |
| Throughput | 60pcs/hr to 70pcs/hr |
| Wave Length | 352nm - 400nm |
| Light Intensity |
>12mW/cm² |
| Power Supply | AC220V50 Hz |
| Weight | 32Kg |
| Dimensions | 550 x 550 x 180mm |
Features
| Compact Tabletop Design: Space-saving unit ideal for laboratories and production areas with limited workspace. |
| User-Friendly Control Panel: Digital interface with real-time monitoring, UV lamp life display, and fault indication for easy operation. |
| Comprehensive Safety System: Includes a safety interlock switch, system fuse, and fully enclosed cover to prevent UV leakage and protect the operator. |
| Efficient UV Curing Performance: 365nm lamps effectively reduce adhesive strength on UV sensitive dicing tape enhancing die yield |
| Consistent and Reliable Results: Provides uniform UV exposure without heat build up, preventing tape damage or over-curing. |
| Versatile Substrate Capability: Suitable for silicon, BGA, ceramic, glass, PC board, and piezoelectric materials (200 mm or 300 mm). |
| Low Maintenance Design: Simple, durable construction with separated UV chamber and electronics for reliability and easy upkeep. |
