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NanoAce duo pro 🆕

The NanoAce Duo Pro is a newly developed 12” semi-automatic dicing saw, equipped with two facing spindles that can simultaneously dice workpieces at high throughput, a vision alignment system and high resolution closed loop linear positioning encoders in Y axes where high performance tolerances are required.

 

This machine has a very small footprint compared to its equivalents. It features an auto-alignment function, auto kerf check function, self-adjustment function, and statistical analysis function. A high-power spindle is also available for this machine.

 

The performance of the NanoAce Duo Pro is underpinned by a new Loadpoint NanoControl control system, which is equipped with a user-friendly 17" LCD touchscreen and operated through an intuitive new user interface. 


Max. Work Capacity (X, Y, Z) 300 x 300 x 4mm(full cut)
300 x 300  x 6mm(partial cut)
Blade Capacity 49mm – 60mm
Chuck-type Ceramic or metal vacuum
Spindle Power 1.8kW @ 60,000rpm
Dimensions (W x D x H) 1280mm x 1120mm x 1880mm (height includes traffic light)

Dicing solutions for:

SEMICONDUCTORS
OPTICAL
ELECTRONICS
MEDICAL
FERRO-ELECTRONICS
SOLAR
OPTO-ELECTRONICS
SONAR

From Prototype to Production and Everything In-between

  • FROM THE LATEST WAFER DESIGNS TO CERAMIC COMPONENTS AND EVERYTHING IN BETWEEN
  • WITH THE MAXIMUM STROKE OF 30MM IN THE Z AXIS, THE NANOACE DUO PRO HAS ALL DICING REQUIREMENTS COVERED
  • TOTAL FLEXIBILITY, TOTAL CONTROL

OPERATIONAL SPECIFICATION

Control System Loadpoint NanoControl 3.0
Work Holding Ceramic or Metal Vacuum Chuck
Work Capacity (XYZ)  Wafer :12"
Square:300 x 300 x 4mm(full cut)
                   300 x300  x 6mm(partial cut)
Blade Capacity (Diameter)  49 mm - 60 mm
Spindle Power  1.8 KW @ 60,000 rpm
X Axis Cutting Range  310 mm
X Axis Resolution  0.1 µm
X Axis Feed Rate  0.01 - 1000 mm/s
Y Axis Index Range  0.001 - 310 mm
Y Axis Resolution  0.1 µm
Y Axis Index Accuracy  Within 3 µm / 310mm (Single step accuracy)  with 2µm/ 5mm
Z Axis Index Range  0.001 - 30mm
Z Axis Resolution  0.1µm
Z Axis Index Accuracy  Repeated positioning accuracy: 1 µm
Theta Axis Drive   Direct Drive Torque motor
Theta Axis Range  380°(continuous) (-60° ~ 320°)
Theta Axis Resolution  ± 3.0 Arc sec
Camera Type  Monochromatic
Camera Alignment  Manual or fully automatic
Camera Resolution  2 MegaPixels
Camera Magnification x48 - x96 - x386
Camera Illumination  Coaxial and ring (with dark field option)
Footprint (WDH) (height includes status light)  1280mm x 1120mm x 1880mm

SERVICE REQUIREMENTS

 Electricity

220v AC  ±10% three phase 20A, 50/60Hz

380v AC ±10% three phase 20A, 50/60Hz

Air supply 5.5 Bar
  0.11m³/min (4 CFM)
Water supply  
Blade coolant 3 - 4 Bar
 

Cutting Water 12 L/min

Workpiece wash Not required
Spindle coolant 3 - 4 Bar
  Same as ambient room temperature
  3 Litres/min
Vacuum supply  Not required, internally generate
Mist extraction  ≥5.0m³/min
Drain

Connecting pipe OD φ38mm

  Drain pipe height from ground  < 550 mm
Recommended Environment  Ambient temp(22±2)℃,Fluctuation:±1℃
Ambient humidity:(55±15)%RH
Weight  1700KG on 4 adjustable feet

 

PIPE SIZES

Port Pipe Diameter
Cutting Wheel Blade Coolant In 16mm
Wafer Wash Water In Not required
Spindle Coolant Water In  10mm
Spindle Coolant Water Out 10mm
Air In 12mm
Vacuum Venturi Exhaust Merges into main exhaust
Mist Extraction Port 101mm
Drain Port

Connecting pipe OD: φ38mm
Factory drainage outlet: ≥φ50mm, Max. distance from machine: ≤2m

Talk to us about your requirements

STANDARD PACKAGE 

Loadpoint Air Bearing Spindle

  • Very low vibration improves the cut quality and reduces chipping
  • DC brushless drive, 1.8 kW 60,000 rev per min
  • High power option 2.2 kW 60,000 rev per min

Vision and alignment system

Manual and automatic alignment modes:

  • Monocular video alignment system with pattern recognition
  • Pattern Recognition System (PRS)
  • Automatic alignment as standard
  • Automatic cutting & kerf check as standard
  • Full 17” touch screen monitor for alignment, data entry and machine monitoring
  • Continuous live display of X,Y,Z and theta co-ordinates
  • Z autofocus set up of alignment image with offset option

Tooling

  • Standard wheel carrier with 60 mm diameter blade capacity
  • Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets
  • Accelerometer based Z datum set, off-chuck height sensing system

Z height sensing

Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers.

Work holding

Standard packages include adaptable plain wafer vacuum chuck for use with wax and substrate mounting and tape rings. Loadpoint manufacture chucks for all tape rings and film frames, mechanical vices, and designs to customer requirements, including precision-ground ceramic inserts for improved vacuum and component support.

Materials Processed

Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others.

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