3230 bACK GRINDER🆕
The Model 3230 is a high-performance, fully automatic 12-inch wafer surface grinding system, specifically engineered for precision wafer thinning applications. It delivers excellent process stability, high throughput, and consistent grinding performance for advanced semiconductor manufacturing.
Key Features:
-
- Supports both 8-inch and 12-inch wafers
- 2-axis system with a 3-worktable configuration for efficient and continuous operation
- High-precision, in-house developed air-bearing spindle and chuck system
- Intuitive and user-friendly operating software for simplified control
- Optimised machine structure for enhanced rigidity and accuracy
- Designed for easy maintenance and convenient servicing
The Model 3230 offers a reliable and efficient solution for high-volume wafer thinning, combining precision engineering with operator-friendly design.
| Work Capacity | Ø 200 mm, Ø 300 mm (universal chuck table) |
| Blade Capacity (Diameter) | Anomalous In-feed grinding |
| Chuck-type | Ceramic |
| Spindle Power | 6.3 kW @ 1,000 - 4,000 rpm |
| Z-Axis Range | 120mm |
| Wafer Total Thickness Variation (TTV) | 8'' wafer: 1.5 μm; 12'' wafer: 3 μm |
| Wafer to Wafer Variation (WTW) | 8'' wafer: ± 2 μm; 12'' wafer: ± 2 μm |
| Ra | 0.02 μm |
| Footprint (W x D x H) | 1415mm x 3325mm x 1820mm |
| Weight (kg) | Approx. 4,600 |