NanoAce 4220 fully automatic dicing saw
The NanoAce 4220 Fully Automatic Dicng Saw is a newly developed 8" fully automatic dicing saw, equipped with dual facing spindles that can dice workpieces simultaneously at high throughput, a vision alignment system and high resolution closed loop linear positioning encoders in Y axes where high performance tolerances are required.
This machine is highly cost-effective due to its rapid dicing speed and fully automated operation. It features an auto-alignment function, auto kerf check function, self-adjustment function, and statistical analysis function. A high-power spindle is also available for this machine.
The performance of the NanoAce 4220 is underpinned by a new Loadpoint NanoControl control system, which is equipped with a user-friendly 17" LCD touch screen and operated through an intuitive new user interface.
| Max. Work Capacity (X, Y, Z) | Φ8 inch |
| Blade Capacity | OD 49mm – 60mm |
| Chuck-type | Ceramic or metal vacuum |
| Spindle Options | 1.8kW, 6,000 – 60,000rpm as standard, or 2.2kW 6,000 – 60,000rpm |
| Dimensions (W x D x H) | 1375mm x 1430mm x 1950mm |
Dicing solutions for:
From Prototype to Production and Everything In-between
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FROM THE LATEST WAFER DESIGNS TO CERAMIC COMPONENTS AND EVERYTHING IN BETWEEN
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WITH THE MAXIMUM STROKE OF 30MM IN THE Z AXIS, THE NANOACE FULLY AUTOMATIC DUO PRO HAS ALL DICING REQUIREMENTS COVERED
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TOTAL FLEXIBILITY, TOTAL CONTROL
OPERATIONAL SPECIFICATION
| Control System | Loadpoint NanoControl 3.0 |
| Work Holding | Ceramic or Metal Vacuum Chuck |
| Work Capacity (XYZ) | Wafer：8" Square：140 x 140 x 4mm（full cut） 140 x 140 x 6mm（partial cut） |
| Blade Capacity (Outer Diameter) | 49mm – 60mm |
| Spindle Power | 1.8 KW @ 60,000 rpm |
| X Axis Cutting Range | 210 mm |
| X Axis Resolution | 0.1 µm |
| X Axis Feed Rate | 0.01 - 1000 mm/s |
| Y Axis Index Range | 0.001 - 210 mm |
| Y Axis Resolution | 0.1 µm |
| Y Axis Index Accuracy | Within 2μm / 210 mm (Single step accuracy) with 2μm / 5 mm |
| Z Axis Index Range | 0.001 - 30mm |
| Z Axis Resolution | 0.1µm |
| Z Axis Index Accuracy | Repeated positioning accuracy: 1 μm |
| Theta Axis Drive | Direct Drive Torque motor |
| Theta Axis Range | 380°(continuous) (-60°～320°) |
| Theta Axis Resolution | ±3.0 Arc sec |
| Camera Type | Monochromatic |
| Camera Alignment | Manual or fully automatic |
| Camera Resolution | 2 MegaPixels |
| Camera Magnification | x48 - x96 - x386 |
| Camera Illumination | Coaxial and ring |
| Footprint (WDH) (height includes status light) | 1375mm x 1430mm x 1950mm |
SERVICE REQUIREMENTS
| Electricity | - 380v AC ±10% three phase 20A, 50/60Hz |
| Air supply | 5 - 8 Bar |
| 650 L/min | |
| Blade coolant | 3 - 4 Bar |
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Cutting Water 6 L/min |
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| Workpiece wash | 3 - 4 Bar |
| Wash water 6 L/min | |
| Spindle coolant | 3 - 4 Bar |
| Same as ambient room temperature | |
| 4L/min | |
| Vacuum supply | Not required, internally generate |
| Mist extraction | ≥5.0m³/min |
| Drain | Connecting pipe OD Φ 38mm |
| Drain pipe height from ground < 550 mm | |
| Recommended Environment |
Ambient temp（22±2）℃ Fluctuation：±1℃ Ambient humidity：（55±15）%RH |
| Weight | 2100KG on 4 adjustable feet |
PIPE SIZES
| Port | Pipe Diameter |
| Cutting Wheel Blade Coolant In | 16mm |
| Wafer Wash Water In | 12mm |
| Spindle Coolant Water In | 10mm |
| Spindle Coolant Water Out | 10mm |
| Air In | 12mm |
| Vacuum Venturi Exhaust | Merges into main exhaust |
| Mist Extraction Port | Φ 101mm |
| Drain Port |
Connecting pipe OD: Φ 38mm Factory drainage outlet: ≥ Φ 50mm Max. distance from machine: ≤2m |
Talk to us about your requirements
STANDARD PACKAGE
Loadpoint Air Bearing Spindle
- Very low vibration improves the cut quality and reduces chipping
- DC brushless drive, 1.8 kW 60,000 rev per min
- High power option 2.2 kW 60,000 rev per min
Vision & alignment system & Cleaning system
- Manual and automatic alignment modes
- Monocular video alignment system with pattern recognition
- Automatic alignment as standard
- Automatic cutting & kerf check as standard
- Full 17” touch screen monitor for alignment, data entry and machine monitoring
- Continuous live display of X,Y,Z and theta co-ordinates
- Z autofocus set up of alignment image with offset option
- Built-it automatic wafer cleaning station, wash and dry
- Automatic, consistent wafer transfer system
Tooling
- Standard wheel carrier with 60 mm diameter blade capacity
- Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets
- Cleaning station with atomised cleaning features
- Accelerometer based Z datum set, off-chuck height sensing system
Z height sensing
Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers.
Work holding
Standard packages include adaptable plain wafer vacuum chuck for use with 8'' and 6'' film frames.
Materials Processed
Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others.