Continuing our work in driving multi layer, multi material technology, Loadpoint, in conjunction with the University of Dundee Institute for Medical Science and Technology, presented the papers:
“Issues in Manufacturing of Wafer-scale 3D Piezoelectric-on-Silicon Structures” at the Bio-Sensors and MEMS packaging conference “Everything in Electronics from the Chip to the Sytem” in Edinburgh 2nd March organised by iMAPS UK. & “3D Silicon on Piezo” at the Piezo 2009 conference “Electroceramics for End users IV” in Zakopane 3rd March, organised by the Piezo Institute.
These papers focused on the development of piezo devices directly driven by silicon, for use in ultra sound applications. Using the current developments in 3D silicon-on-silicon devices as a starting point, the papers describe the state of art of the manufacturing processes that will be required, and possible sources of future process developments.