Large castings milled to ± 5 microns straightness and flatness

Loadpoint Micro-Machining Solutions, a manufacturer in Cricklade that more than 40 years ago invented the industry standard saw for dicing semiconductor wafers, avoiding current leakage in electronic components caused by the old method of scribing and snapping wafers, has brought all of its metalcutting in-house following the purchase of three new Hurco machine tools.

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Loadpoint release 3rd generation NanoAce for 8” & 12” applications

The new NanoAce 3200 and 3300 incorporates touchscreen technology for the first time. The user interface remains friendly and intuitive, with the use of a 21 inch widescreen monitor allowing the operation panel to be displayed on screen at all times. The new NanoAce machines benefit from the latest version of Loadpoint’s Windows 10 based NanoControl software.

The machine has been remodelled to give a modern and ergonomically designed feel to its operation. The coolant containment doors of the previous generation of machines have been replaced with horizontal sliding windows for easy blade change and vertical lift-up work loading door that gives easy clear access for the loading and unloading of the workpiece.