Loadpoint presents developments in Piezoelectric-on-Silicon structures

Continuing our work in driving multi layer, multi material technology, Loadpoint, in conjunction with the University of Dundee Institute for Medical Science and Technology, presented the papers:
“Issues in Manufacturing of Wafer-scale 3D Piezoelectric-on-Silicon Structures” at the Bio-Sensors and MEMS packaging conference “Everything in Electronics from the Chip to the Sytem” in Edinburgh 2nd March organised by iMAPS UK. & “3D Silicon on Piezo” at the Piezo 2009 conference “Electroceramics for End users IV” in Zakopane 3rd March, organised by the Piezo Institute.

These papers focused on the development of piezo devices directly driven by silicon, for use in ultra sound applications. Using the current developments in 3D silicon-on-silicon devices as a starting point, the papers describe the state of art of the manufacturing processes that will be required, and possible sources of future process developments.

Loadpoint and Ferro-Electric Materials Processing

Loadpoint now has an expanded capability for processing ferroelectric materials. The new MacroAce provides the ability to dice or slice large blocks of PZT materials for ultrasonic applications. These can be up to 250 x 250 x 30 mm or fine features on the top of 100 mm high components.

The PicoAce grinder is now grinding elements down to 40 micron thick. This machine has the proven capability to grind diced and filled arrays to 50 micron thickness using film frame work holding techniques.

Manufacturing techniques are now being explored for new NDT imaging sensors and systems. These will be based on the NanoAce and MicroAce machines as well as the MacroAce. When developing a manufacturing process Loadpoint focuses on using production technique so that the transfer from R&D to production is as smooth as possible. This covers the machine, dicing blades, work holding with control and metrology as needed to provide a complete turn key system.