Loadpoint presented a paper at the IMAPS October 2008 conference in Munich outlining its view on dicing the upcoming multi material 3D packages for PZT applications. This included a list of other processes required with possible sources of those technologies.
MacroAce is a very large capacity dicing machine for heavy duty single and multiple blade applications. A work capacity of 250 x 250 x 30 mm combined with 120 mm of spindle vertical movement enables diced or slotted features to be machined on the top of thick assemblies…
Loadpoint now has an expanded capability for processing ferroelectric materials. The new MacroAce provides the ability to dice or slice large blocks of PZT materials for ultrasonic applications. These can be up to 250 x 250 x 30 mm or fine features on the top of 100 mm high components.
The PicoAce grinder is now grinding elements down to 40 micron thick. This machine has the proven capability to grind diced and filled arrays to 50 micron thickness using film frame work holding techniques.
Manufacturing techniques are now being explored for new NDT imaging sensors and systems. These will be based on the NanoAce and MicroAce machines as well as the MacroAce. When developing a manufacturing process Loadpoint focuses on using production technique so that the transfer from R&D to production is as smooth as possible. This covers the machine, dicing blades, work holding with control and metrology as needed to provide a complete turn key system.
Swindon, UK – Loadpoint Ltd. have been asked to dice Infrared filters to be incorporated into the Mars Climate Sounder. The MCS is one of the ultramodern instruments aboard the Mars Reconnaisance Orbiter, timetabled for launch from Cape Canaveral in August 2004. On arriving at the Red Planet the craft will orbit at an altitude of 350 kilometres where it will spend two earth-years undertaking scientific research. The MCS will take vertical profiles of atmospheric radiance; the data generated being used to plot the exchange of water between the surface and the atmosphere.
The filters are being produced by the University of Reading Infrared Multilayer Laboratory who asked Loadpoint to undertake the precision dicing of Germanium substrates at their subcontract facility in Swindon, UK. With over 40 years of experience in dicing Loadpoint is one of the most established dicing machine manufacturers in the market. Loadpoint Director John Sweet said of their wafer dicing subcontract service ‘this type of technically sophisticated job is where Loadpoint’s depth of experience in dicing benefits our clients in both production time and materials cost. As we’ve been involved in the development of electronic components for so long we find we are the place that people come when they have new, difficult materials to dice. These aren’t the first Loadpoint diced parts to be sent into space and they won’t be the last.’
Loadpoint Ltd. undertake subcontract dicing on their own range of dicing machines, which dice wafers up to 300mm diameter. If you would like further information on Loadpoint’s range of dicing and post-dicing equipment, dicing subcontract facilities and consumables supply service please try their website at www.loadpoint.co.uk, email Loadpoint at firstname.lastname@example.org or telephone 01793 751160 to discuss your dicing requirements with one of Loadpoint’s sales team.
Loadpoint Ltd. have announced the addition of their NanoAce 300mm diameter high-precision dicing saws to their subcontract facility in Swindon, UK. The versatile NanoAce dices materials including Alumina, BGA mouldings, Ceramic, Glass, Lead Zirconate Titanate, FibreBoard and Silicon and can be controlled in 4 axes (x, y, z, and theta). Loadpoint’s customers use the wafer dicing subcontract facility to develop dicing processes for singulation of IC’s, LED’s, MEMS and other devices. The facility benefits from both the extensive dicing experience of our staff and the versatility of our machines, which are designed and built in-house. With the development of Wafer Level Packaging dicing saws as adaptable as the NanoAce are set to become more and more valuable to product development.
Loadpoint’s experience in dicing has earned them a place among some of Europe’s leading semiconductor manufacturers who are currently researching the process technology that will enable production of the next generation of ultra-thin IC’s. Company Director John Sweet says “For semiconductor dicing high precision diamond saws like the NanoAce are the most effective option for cost and productivity. Now we are pushing back the boundaries of this field of production engineering to ever finer levels of finish and quality”.
Further details on Loadpoint’s dicing subcontract facilities and their range of dicing and post-dicing equipment can be found at www.loadpoint.co.uk alternatively telephone 01793 751160 to discuss your dicing requirements with one of Loadpoint’s sales team.