Microace 66
The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle set-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.
Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines.
NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that remains robust for many years of service.
NanoControl is that it can be tailored to a customer’s application. This could involve taking the hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.
| Max. Work Capacity (X, Y, Z) | 152mm x 152mm x 16mm |
| Blade Capacity | 50.8mm – 76.2mm, (101.6mm option available) |
| Chuck-type | Ceramic or metal vacuum |
| Spindle Options | 1.8kW, 3,000 – 60,000rpm as standard, or 3.0kW 3,000 – 10,000 rpm |
| Dimensions (W x D x H) | 570mm x 1215mm x 1555mm |
Dicing solutions for:
From Prototype to Production and Everything In-between
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FROM THE LATEST WAFER DESIGNS TO CERAMIC COMPONENTS AND EVERYTHING IN BETWEEN
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WITH CUT DEPTHS OF UP TO 16MM,THE MICROACE 66 HAS ALL DICING REQUIREMENTS COVERED
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TOTAL FLEXIBILITY, TOTAL CONTROL
Operational Specification
| Control System | Loadpoint NanoControl 2.10 |
| Work Holding | Ceramic or Metal Vacuum Chuck |
| Work Capacity (XYZ) | 152 x 152 x 16mm (Custom configurations to work area & blade capacity are achievable) |
| Blade Capacity (Diameter) | 50 - 76.2mm |
| Spindle Power | 1.8 KW @ 60,000 rpm or 3.0 KW @ 10,000 rpm |
| Spindle Speed | 3,000 - 60,000 rpm |
| X Axis Cutting Range | 160 mm |
| X Axis Resolution | 0.1 µm |
| X Axis Feed Rate | 0.1 - 500 mm/s |
| Y Axis Index Range | 0.001 - 152 mm |
| Y Axis Resolution | 0.1 µm |
| Y Axis Index Accuracy | ± 3 µm / 200mm < ± 1µm / 10mm |
| Z Axis Index Range | 0.001 - 20mm |
| Z Axis Resolution | 0.1µm |
| Z Axis Index Accuracy | ± 2 µm / 10mm |
| Theta Axis Drive | Direct Drive Torque motor |
| Theta Axis Range | 360°(continuous) |
| Theta Axis Resolution | 4 arc sec |
| Camera Type | Monochromatic or full Colour |
| Camera Alignment | Manual or fully automatic |
| Camera Resolution | 2 MegaPixels |
| Camera Magnification | x150 - x200 - x300 |
| Camera Illumination | Coaxial and ring (with dark field option) |
| Footprint (WDH) (height includes status light) | 570 x 1215 x 1555 mm |
Service Requirements
| Electricity | 220/240v AC single phase 10A, 50/60Hz |
| Air supply | 5.5 Bar (80 PSI) |
| 0.11m3/min (4 CFM) | |
| Dewpoint 5°C, Oil 0.005 PPM | |
| Water supply | |
| Blade coolant | 3 - 5 Bar (43 – 73 PSI) |
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5 - 8 Litres/min (1.3-2.1 US gal/min) |
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| Workpiece wash | 3 - 5 Bar (43 – 73 PSI) |
| 5 - 8 Litres/min (01.3-2.1 US gal/min | |
| Spindle coolant | 3 - 5 Bar (43 – 73 PSI) |
| 18 - 20°C Recirculating Coolant Temp | |
| 1 Litres/min (0.26 US gal/min) | |
| Vacuum supply | Not required, internally generate |
| Mist extraction | Mandatory 4m³/min |
| Drain | 42 mm ID drain, free flow to waste |
| Drain height < 600 mm (24”) from base of m/c | |
| Recommended Environment | Ambient temp of 20˚C, humidity level < 40% |
| Weight | 570KG on 4 adjustable feet (up to 10mm) |
| Floor Level | < 6mm across m/c footprint |
Pipe Sizes
| Port | Pipe Diameter |
| Cutting Wheel Blade Coolant In | 10mm |
| Wafer Wash Water In | 10mm |
| Wafer Wash Water In | 10mm |
| Spindle Coolant Water Out | 10mm |
| Air In | 10mm |
| Vacuum Venturi Exhaust | 10mm |
| Mist Extraction Port | 40mm |
| Drain Port | 40mm |
Talk to us about your requirements
Standard Package
Loadpoint Air Bearing Spindle
- Very low vibration improves the cut quality and reduces chipping
- DC brushless drive, 1.8 kW 60,000 rev per min
- High power option 3.0 kW 10,000 rev per min
- Theta (θ) axis bearing rotary table with high resolution direct drive
Vision and alignment system
Manual and automatic alignment modes:
- Monocular video alignment system with pattern recognition
- Pattern Recognition System (PRS)
- Alignment system with programmable off-set for off-cut alignment
- Manual and automatic (option) kerf and chipping measurement on machine
- Full 17” / 430mm monitor for alignment, data entry and machine monitoring
- Continuous live display of X,Y,Z and theta co-ordinates
- Z autofocus set up of alignment image with offset option for depth of cut
Tooling
- Standard wheel carrier with 50 to 76.2mm diameter blade capacity
- Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets
- Accelerometer based Z datum set, off-chuck height sensing system
Z height sensing
Off-chuck height sensing system ensures constant depth of cut without having to use conductive blades, providing a wider choice of blade diameters and suppliers.
Work holding
Standard packages include adaptable plain wafer vacuum chuck for use with wax and substrate mounting and tape rings. Loadpoint manufacture chucks for all tape rings and film frames, mechanical vices, and designs to customer requirements, including precision-ground ceramic inserts for improved vacuum and component support.
Materials Processed
Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon amongst others.