Dicing Machines

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MicroAce 66

MicroAce 66

The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle sets-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.

Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.

Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)162mm x 162mm x 13mm
Blade Capacity50.8mm – 76.2mm, (101.6mm option available)
Chuck-typeCeramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
Spindle Options2.4kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 30,000 rpm, or 1.8kW low-vibration option
Dimensions (W x D x H)570mm x 1215mm x 1555mm
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NanoAce 3200

NanoAce 3200

The NanoAce 3200 is an 8” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3200 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.

NanoControl can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)250mm x 250mm x 13mm
Blade Capacity50.8mm – 101.6mm
Chuck-typeCeramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
Spindle Options1.8kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 60,000rpm
Dimensions (W x D x H)1046mm x 1030mm x 2048mm (height includes traffic light)

NanoAce 3300

NanoAce 3300

The NanoAce 3300 is a 12” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3300 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.

NanoControl can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)300mm x 300mm x 13mm
Blade Capacity50.8mm – 101.6mm
Chuck-typeCeramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
Spindle Options1.8kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 60,000rpm
Dimensions (W x D x H)1046mm x 1030mm x 2048mm (height includes traffic light)

MacroAce II

MacroAce II

MacroAce II for heavier duty applications requiring high power spindle delivery and large work areas.
The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic & metal cutting applications. Additionally, cut depths of up to 60mm with cut lengths of up to 450mm help make the MacroAce II a best-in-class leader.

The MacroAce II is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays.

The performance of the MacroAce II is underpinned by the Loadpoint NanoControl control system; a common control platform used across all our machines. Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)Rotational Capacity, 305mm x 305mm x 100mm Non-rotational Capacity, 420mm x 305mm x 100mm
Blade Capacity100mm - 200mm (*60mm cut depth with 200mm dia. blade)
Chuck-type Ceramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
Spindle Options4kW, 1,000 – 10,000rpm
Dimensions (W x D x H)1440mm x 1400mm x 2350mm (height includes traffic light)
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Washpoint

Washpoint

Introduce consistent quality of output following post-dicing / photoresist processes. Improve production line productivity.

The Washpoint is a self-contained, fully integrated free standing washing station for cleaning and drying wafers, substrates or plates up to 300mm in diameter following dicing, scribing or other machining processes.

A flexible washing process allows all elements of the cleaning and drying sequence; cycle time, water pressure, gas pressure and dry heat output to be easily adjusted to meet individual process demands. The compact footprint ensures you get the most out of your available floor space.

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Presspoint

Presspoint

Presspoint – Tape Ring Applicator

A low cost solution for tape ring / hoop ring preparation and mounting. Can also be used as a simple die expander.

The Loadpoint Presspoint is one of the most versatile and efficient manual closing and post dicing stretch systems available. It requires no power and is usable straight from the box.

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