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Large castings milled to ± 5 microns straightness and flatness

Loadpoint Micro-Machining Solutions, a manufacturer in Cricklade that more than 40 years ago invented the industry standard saw for dicing semiconductor wafers, avoiding current leakage in electronic components caused by the old method of scribing and snapping wafers, has brought all of its metalcutting in-house following the purchase of three new Hurco machine tools.

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